Aries Electronics - Your Best Source for Interconnection and Packaging Solutions
 

High-Frequency (RF) Test Sockets for IC Package Styles:

CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and Any and All SMT Package Styles made With or Without Leads. Can also be compatible with PGA packaged devices.

Eliminate Probe Cleaning, Prevent Solder & Debris from Adhering to Probe Tips, Reduce Downtime, Increase Throughput and Save Money with Protect-A-Probe™

  DESCRIPTION
DATA SHEET PDF



RF MicroStrip™

RF Test Sockets w/Replaceable Contact Strips

These sockets use our patented Microstrip™ contacts which lie flat on the DUT board and become part of the transmission line. Self-inductance as low as 0.01nH and Frequency Response to 19GHz.




High-Frequency Interposer Socket

High-Frequency (RF) Interposer Socket

Now you can get the best of both worlds! The Kapton Interposer socket gives you the high-frequency characteristics of our Microstrip™ Contact Socket combined with the close component placement of our Spring-Probe Sockets. Signal paths can be as short as 0.008" [0.203mm] while the pad layouts can be identical to the package footprint with an operating range -40°C to 150°C.




High-Frequency Center Probe Test Socket for Devices up to 6.5mm Square

High-Frequency Center Probe™ Test Socket for Devices up to 6.5mm Square

For test and dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices with pitches from 0.20mm and higher.




High-Frequency Center Probe Test Socket for Devices up to 13mm Square

High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square

For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices on any pitch of 0.20mm pitch or higher. This socket is easily mounted and removed to & from the PCB due to solderless pressure-mount compression Spring-Probes.




High-Frequency Center Probe Test Socket for Devices from 14 to 27mm Square

High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square

Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.20mm with Frequency Response over 10GHz!




High-Frequency Center Probe™ Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square

High-Frequency Center Probe™ Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square

For test and dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices with pitches down to 0.20mm.




Machined High-Frequency Center Probe Test Socket for BGA, CSP & MLF Packages

Machined High-Frequency Center Probe™ Test Socket for BGA, CSP & MLF Packages

Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.20mm with Frequency Response over 10GHz!




High-Frequency Center Proce Test Socket for Devices up to 40mm Square

High-Frequency Center Probe™ Test Socket for Devices up to 40mm Square

For high-frequency Testing & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices on any pitch device on 0.20mm or larger. The 4-point Crown insures “scrub” on solder oxides.




High-Frequency Center Probe Test Socket for Devices up to 55mm Square

High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square

For high-frequency testing of CSP, BGA, DSP, LGA, SRAM, DRAM, and Flash devices on any pitch of 0.20mm or larger. The four-point crown insures “scrubbing” of solder oxides, while pointed probe works with LGA’s, MLF’s, etc.




24014 Optical Laser Failure Analysis Microscopy for Test Socket
CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy on any grid size pitch of 0.2mm or higher



Kelvin Test Socket

Kelvin Test Socket

Low resistance testing using dual, independent Spring-Probe Technology for testing of MLF, QFN, LGA and other leadless devices. Socket is easily mounted and removed to and from the test board via solderless pressure mount compression Spring-Probes, accurately located by two molded plastic alignment pins and mounted with four stainless steel screws.




TEST REPORTS

Microstrip CSP Socket DC Cycling
Microstrip CSP Socket DC Measurement
Microstrip CSP Socket RF Cycling
Microstrip QFP 0.5mm 64-pin Socket Electrical Characterization
Microstrip QFP 0.5mm Socket Return Loss Graph
Microstrip QFP Socket DC Cycling
Microstrip QFP Socket RF Cycling
Microstrip QFP Socket RF Measurement
Microstrip QFP Socket DC Measurement
Microstrip SSOP 20-pin 0.65mm pitch Socket Return Loss Graph
Microstrip SSOP 20-pin Test Socket Electrical Characterization

Center Probe 0.4mm Socket Return Loss Test
Center Probe 0.5mm BGA Socket Electrical Performance

Center Probe 0.5mm Socket Return Loss Graph
Center Probe BGA 0.8mm Socket Electrical Characterization
Center Probe Contacts Decibel Frequency Graph
Center Probe CSP Socket DC Cycling
Center Probe CSP Socket DC Measurement
Center Probe CSP Socket RF Measurement
Center Probe CSP Socket RF Cycling

Kapton CSP RF Measurement
Kapton CSP Socket DC Cycling
Kapton CSP Socket DC Measurement
Kapton CSP Socket RF Cycling
Kapton Interposer 0.5mm Socket Electrical Characterization
Kapton Interposer Decibel Graph
Kapton QFP Socket DC Cycling
Kapton QFP Socket DC Measurement
Kapton QFP Socket RF Cycling
Kapton QFP Socket RF Measurement

ASSEMBLY DESIGN

Microstrip Large RF Socket Assembly and Footprint
Microstrip Medium RF Socket Assembly and Footprint
Microstrip QFP Std Hinge Lid Assembly
Microstrip Small RF Socket Assembly and Footprint

RF MICROSTRIP CONTACT

Signal Path Length: 0.005" and 0.007"
Operating Temperature: -55°C to +150°C
Insertions: 500,000
Self-Inductance: 0.01nH
Bandwidth: 16GHz at -1dB (0.50mm pitch)
Contact Resistance: <70 milliohms

RF CENTER PROBE CONTACT

Signal Path Length: as short as 0.077"
Operating Temperature: -55°C to +150°C
Insertions: >500,000
Self-Inductance: 0.51nH
Bandwidth: 18.0GHz at -1dB (0.5mm pitch)
Contact Resistance: <70 milliohms

RF KAPTON INTERPOSER

Signal Path Length: as short as 0.011"
Operating Temperature: -40°C to 150°C
Insertions: >50,000
Self-Inductance: 0.09nH
Bandwidth: 40GHz at -1dB
Contact Resistance: <40 milliohms