Aries Electronics - Your Best Source for Interconnection and Packaging Solutions

High-Frequency Interposer Socket

FEATURES

  • Pressure-mount plunge to board interposer
  • Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more
  • Very low inductance per contact site
  • High cycle life with easy maintenance
  • Manual or Automated Handler applications

GENERAL SPECIFICATIONS

  • INSERTION LOSS: less than -1dB to 40GHz
  • SOCKET BODY MATERIAL: specified at time of quotation
  • INTERPOSER: etched Kapton with Au-plated Pads and Compliant Pads on bottom side
  • AVAILABLE PITCHES: down to 0.32mm
  • CONTACT SELF-INDUCTANCE: 0.11nH (0.50mm pitch CSP).
  • VSWR <2:1 to 40GHz
  • CONTACT RESISTANCE: <20mΩ
  • CONTACT FORCE: 15-25 grams
  • CURRENT CAPACITY: 2 amps (continuous) 4 amps (peak)
  • CONTACT LIFE: 50,000-100,000
  • SIGNAL PATH LENGTH: 0.011 (with compliant pads)
  • MUTUAL CAPACITANCE: 0.015pF
  • TEMPERATURE OPERATING RANGE: -40°C to 150°C

MOUNTING CONSIDERATIONS

  • SUGGESTED PCB PADS: Au-plated
  • MOUNTING FORCE: 5-oz inches [0.035Nm]

SUGGESTED CARE & CLEANING

Reference-Only Drawing for High-Frequency Interposer Socket

DEVICE ARRAY EXAMPLE SHOWN. YOUR DEVICE ARRAY WILL BE CENTERED ABOUT THE CENTERLINES SHOWN.

 

NOTICE

ALL DIMENSIONS IN INCHES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

Download Data Sheet 24007, Rev 1.8