High-Temp Test & Burn-in Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
KEY PERFORMANCE ELEMENTS – Series AR4HT
Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time.
For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices.
Quick and Easy Interposer Replacement System: the complete interposer can be removed and a new one (interposer) and be inserted quickly and easily. This saves time and money in your test setup.
High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing).
Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice for low-cost hand test applications.
ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED
PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.