Aries Electronics - Your Best Source for Interconnection and Packaging Solutions

Your Best Source for Interconnection & Packaging Solutions!

       

 

Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.

We’ve created a source for electronic component design engineers to download technical Data Sheets with of variety of interconnect products for Test and Burn-in applications including...

  • ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC Devices
  • Correct-A-Chip™ Product Line of “Intelligent Connectors” – incorporating Passive and Active Components
  • Adapters – Connectors Using One Termination Style on Boards Designed for Different Styles
  • BGA (Ball Grid Array) and LGA (Land Grid Array) Sockets
  • High-Frequency (RF) Test and Burn-in Sockets

Aries Has Mastered These Manufacturing Processes...

  • Installation of Pins into Plastic
  • Molding Engineered Plastics with Tight Tolerances
  • Crimping Connectors on Flat Cable
  • Flat Cable Wire Stripping and Separation
  • Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at 10GHz)
  • Surface-mounting of Electronic Components
  • Bending Pins (Vertisocket™ Line)
  • Patented Limited-Depth Pin Assembly
  • Assembly of Solder Balls on Ceramic PC Boards and Connectors

 



New Switch-A-Pitch Adaptors from Aries Electronics Enable Use of Smaller Pitch Devices with More Cost-effective, Larger Pitch Boards New Switch-A-Pitch Adapters Enable Use of Smaller Pitch Devices with More Cost-effective, Larger Pitch Boards

Aries adds a unique Adapter Series to its extensive line of Correct-a-Chip Adapters that save end users both time and money. (read more) See also MicroConnections article.

New 6.5mm Center Probe Test Socket Features Versatile Design Ideal for Test and Burn-In New 6.5mm Center Probe Socket Features Versatile Design Ideal for Test & Burn-In

Now offerng a new high-frequency Center Probe Test Socket comprised of a standard molded format that enables the socket to accommodate any device 6.5mm or smaller. (read more)

Aries Electronics' New Test, Burn-In and RF Sockets Now Accommodate Pitches Down to 0.3mm New CSP/µBGA Test & Burn-In Socket Accommodates Devices up to 6.5mm Squared

New CSP/BGA test and burn-in and RF sockets, including 13mm squared, 27mm squared, 40mm squared and 55mm squared models, to accommodate devices with pitches down to 0.3mm. (read more)
CEO Bill Sinclair and, from left, Joe Midili, Paul Ruo and Roy Larsen represent Aries Electronics at the annual Semicon West in San Francisco, CA in July.
  CEO Bill Sinclair and, from left manning the booth, Joe Midili, Paul Ruo and Roy Larsen represent Aries Electronics at the annual Semicon West in San Francisco, CA in July 2008.  

Find Out What Aries is Doing about RoHS.
RoHS Compliance Plan Download PDF Version

ISO 9001:2000 Approval
Find Out What Aries is Doing about RoHS. Download our RoHS Compliance Plan
 Aries Electronics, Inc. is committed to RoHS compliance and will make every effort to assist our customers by making available as much information as possible. This information will continue to change as additional data becomes available.
Find Out What Aries is Doing about RoHS. Download our RoHS Compliance Plan ISO 9001:2000 Approval