Aries Electronics - Your Best Source for Interconnection and Packaging Solutions

Your Best Source for Interconnection & Packaging Solutions!

New CSP Sockets Enable Testing of Any Area-array Device to +200°C High-temp Sockets New CSP Sockets Enable Testing of Any Area-array Device to +200°C High-temp Sockets

now offers the industry's first CSP sockets that accept any area-array device for high-temperature testing up to +200°C. The new AR4HT Series sockets incorporate a low-profile 0.45 mm contact structure (compressed) that is shorter than other low-profile contacts and provides excellent compliance for reliable ATE testing and burn-in. (read more)

Fine Pitch Bump Adapters Now Allow for SMT Adaptation Machined High-Frequency Center Probe Test Sockets Now Available in Pitch Sizes Down to 0.30mm

Machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30mm. With very low inductance and capacitance, the sockets are ideal for a wide variety of BGA, CSP, and MLF packages. (read more)

Machined High-Frequency Center Probe Test Sockets Now Available in Pitch Sizes Down to 0.30mm

Machined High-Frequency Center Probe Test Sockets Now Available in Pitch Sizes Down to 0.30mm

Machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30mm. With very low inductance and capacitance, the sockets are ideal for a wide variety of BGA, CSP, and MLF packages. (read more)

Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 150 full-spec Product Data Sheets available for viewing, downloading, and printing.

We’ve created a source for electronic component design engineers to download technical Data Sheets with of variety of interconnect products for Test and Burn-in applications including...

  • ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC Devices
  • Correct-A-Chip™ Product Line of “Intelligent Connectors” – incorporating Passive and Active Components
  • Adapters – Connectors Using One Termination Style on Boards Designed for Different Styles
  • BGA (Ball Grid Array) and LGA (Land Grid Array) Sockets
  • High-Frequency (RF) Test and Burn-in Sockets
 

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Aries Has Mastered These Manufacturing Processes...

  • Installation of Pins into Plastic
  • Molding Engineered Plastics with Tight Tolerances
  • Crimping Connectors on Flat Cable
  • Flat Cable Wire Stripping and Separation
  • Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at 10GHz)
  • Surface-mounting of Electronic Components
  • Bending Pins (Vertisocket™ Line)
  • Patented Limited-Depth Pin Assembly
  • Assembly of Solder Balls on Ceramic PC Boards and Connectors
  CEO Bill Sinclair and, from left, Joe Midili, Paul Ruo and Roy Larsen represent Aries Electronics at the annual Semicon West in San Francisco, CA in July.  
  CEO Bill Sinclair and, from left manning the booth, Joe Midili, Paul Ruo and Roy Larsen represent Aries Electronics at the annual Semicon West in San Francisco, CA  
Find Out What Aries is Doing about RoHS. Download our RoHS Compliance Plan
Find Out What Aries is Doing about RoHS. Download our RoHS Compliance Plan ISO 9001:2008 Approval
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REACH Compliance
Aries Electronics, Inc. is committed to RoHS compliance and will make every effort to assist our customers by making available as much information as possible. This information will continue to change as additional data becomes available.