Aries Electronics - Your Best Source for Interconnection and Packaging Solutions
 

Burn-in & Test Sockets for IC Package Styles:

CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and Any and All SMT Package Styles made With or Without Leads. Can also be compatible with PGA packaged devices.

Confused by the different types of sockets?
Unsure which socket is correct for your application?
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  DESCRIPTION
DATA SHEET PDF



CSP/BallNest™ Hybrid Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices

CSP/BallNest™Hybrid Socket

Suitable for prototyping, testing or burn-in of CSP, BGA, µBGA and LGA devices on any grid size pitch from 0.20mm




CSP/µBGA Test & Burn-In Socket for Devices up to 6.5mm Square



CSP/µBGA Test & Burn-In Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices up to 13mm Square

CSP/µBGA Test & Burn-In Socket for any device package on 0.2mm pitch and higher up to 13mm Square




CSP/µBGA Test & Burn-In Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices 14-27mm Square

CSP/µBGA Test & Burn-In Socket for any device package on 0.2mm pitch and higher up to 14-27mm Square




CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for any device package on 0.2mm pitch and higher up to 27mm Square



CSP/µBGA Test & Burn-In Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices up to 40mm Square

CSP/µBGA Test & Burn-In Socket for any device package on 0.2mm pitch and higher up to 40mm Square




CSP/µBGA Test & Burn-In Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices up to 55mm Square

CSP/µBGA Test & Burn-In Socket for any device package on 0.2mm pitch and higher up to 55mm Square




Kelvin Test Socket

Kelvin Test Socket

Low resistance testing using dual, independent Spring-Probe Technology for testing of MLF, QFN, LGA and other leadless devices.




23023 Optical Laser Failure Analysis Microscopy for Test Socket
CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy on any grid size pitch of 0.2mm or higher



Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices



Protect-A-Probe™ anti-diffusion, gold coating
Protect-A-Probe™ anti-diffusion, gold coating for its complete line of burn-in and test socket spring-probes.